Easy-Clean Soldering Flux for Electronics
The flux residue easily washes away with water. The flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Paste flux is easy to apply for precision applications.
Container | Tip | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| For Joining | Size | Net Weight | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
| Copper, Brass, Bronze | 0.3 fl. oz. | __ | Pen | Chisel | 0.2" | Liquid | Water | IPC J-STD-004 | Outside United States and Canada | 0000000 | 00000 |
| Nickel Alloys, Copper, Brass | 0.3 fl. oz. | __ | Pen | Chisel | 0.157" | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
| Nickel Alloys, Copper, Brass | 0.3 fl. oz. | __ | Syringe | Needle Point | 0.031" | Paste | Water | IPC J-STD-004 | __ | 000000 | 00000 |
| Nickel Alloys, Copper, Brass | 2 fl. oz. | __ | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 0000 |
| Nickel Alloys, Copper, Brass | 4 fl. oz. | __ | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
| Nickel Alloys, Copper, Brass | 16 fl. oz. | __ | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
| Nickel Alloys, Copper, Brass | 32 fl. oz. | __ | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
| Nickel Alloys, Copper, Brass | 1 gal. | __ | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
| Nickel Alloys, Copper, Brass | __ | 8 oz. | Jar | __ | __ | Paste | Water | IPC J-STD-004 | __ | 0000000 | 00000 |
| Nickel Alloys, Copper, Brass | __ | 1 lbs. | Jar | __ | __ | Paste | Water | IPC J-STD-004 | __ | 0000000 | 00000 |
No-Clean Soldering Flux for Electronics
This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Paste flux is easier to apply than liquid flux for precise applications.
Container | Tip | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| For Joining | Size | Net Weight | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Features | Cannot Be Sold To | Each | |
| Copper, Brass, Bronze | 0.3 fl. oz. | __ | Pen | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | __ | Outside United States and Canada | 0000000 | 00000 |
| Nickel Alloys, Copper, Brass, Bronze | 0.3 fl. oz. | __ | Syringe | __ | __ | Paste | No Clean | IPC J-STD-004 | Luer Lock Connection | __ | 0000000 | 00000 |
| Nickel Alloys, Copper, Brass, Bronze | __ | 3 1/2 oz. | Jar | __ | __ | Paste | No Clean | IPC J-STD-004 | __ | __ | 0000000 | 00000 |
| Nickel Alloys, Copper, Brass, Bronze | __ | 1 lbs. | Jar | __ | __ | Paste | No Clean | IPC J-STD-004 | __ | __ | 0000000 | 000000 |
Lead-Free No-Clean Soldering Flux for Electronics
This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Tip | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| For Joining | Container Size, fl. oz. | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
| Copper, Brass, Bronze | 0.3 | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | Outside United States and Canada | 0000000 | 000000 |
Mildly-Activated Rosin Soldering Flux for Electronics
This flux has strong cleaning action and leaves residue that will not compromise the reliability of the joint. The residue requires flux remover. Use this flux to clean and prepare electrical assemblies and printed circuit boards for soldering.
Paste flux is easy to apply in precise applications.
Container | Tip | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| For Joining | Size | Net Weight | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Each | |
| Copper | 1/5 fl. oz. | __ | Pen | Needle Point | 0.013" | Liquid | Flux Remover | IPC J-STD-004 | 0000000 | 000000 |
| Copper, Nickel Alloys, Brass | 10 ml | __ | Syringe | Needle Point | 0.055" | Paste | Flux Remover | IPC J-STD-004 | 00000000 | 00000 |
| Copper, Nickel Alloys, Brass | __ | 8 oz. | Jar | __ | __ | Paste | Flux Remover | IPC J-STD-004 | 00000000 | 00000 |
| Copper, Nickel Alloys, Brass | __ | 1 lbs. | Jar | __ | __ | Paste | Flux Remover | IPC J-STD-004 | 00000000 | 00000 |
| Copper, Nickel Alloys, Brass, Bronze, Zinc | 1 gal. | __ | Bottle | __ | __ | Liquid | Flux Remover | IPC J-STD-004 | 0000000 | 00000 |
Fully-Activated Rosin Soldering Flux for Electronics
Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
| For Joining | Container Size, gal. | Form | Cleanup Method | Specifications Met | Each | |
| Nickel Alloys, Copper, Brass, Bronze, Zinc | 1 | Liquid | Flux Remover | IPC J-STD-004 | 0000000 | 000000 |
Nonactivated Rosin Soldering Flux for Electronics
This flux has less cleaning action, but leaves the least amount of residue. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Container | Tip | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| For Joining | Size | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
| Nickel Alloys, Copper, Brass, Bronze, Zinc | 1 gal. | Bottle | __ | __ | Liquid | Flux Remover | IPC J-STD-004 | __ | 0000000 | 000000 |
| Copper, Brass, Bronze | 0.3 fl. oz. | Pen | Chisel | 0.2" | Liquid | Flux Remover | IPC J-STD-004 | Outside United States and Canada | 0000000 | 0000 |
Fully-Activated Rosin Soldering Flux for High-Temperature Electronics
With the strongest cleaning power, this flux is fully activated to clean and prepare electrical assemblies and printed circuit boards for high-temperature soldering applications. However, it requires flux remover to clean residue for a reliable joint.
No-Clean Soldering Flux for Low-Melting-Point Solders
Prepare workpieces for low-temperature lead-free soldering. This flux leaves minimal residue, so there’s no cleanup required. It doesn’t need to be used quickly; it can sit for hours without degrading.