Fully Activated Soldering Flux

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Minimum Application Temperature

390° F

Maximum Application Temperature

840° F

Soldering Flux Activation

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DFARS Specialty Metals

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3 Products

Fully-Activated Rosin Soldering Flux for High-Temperature Electronics

With the strongest cleaning power, this flux is fully activated to clean and prepare electrical assemblies and printed circuit boards for high-temperature soldering applications. However, it requires flux remover to clean residue for a reliable joint.

4 fl. oz.
For Joining	Form	Cleanup Method	Application Temperature Range, °F	Specifications Met		Each
Nickel Alloys, Copper, Brass, Bronze, Zinc	Liquid	Flux Remover	390° to 840°	IPC J-STD-004	0000000	000000
16 fl. oz.
Nickel Alloys, Copper, Brass, Bronze, Zinc	Liquid	Flux Remover	390° to 840°	IPC J-STD-004	0000000	00000

Fully-Activated Rosin Soldering Flux for Electronics

Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.

For Joining	Container Size, gal.	Form	Cleanup Method	Specifications Met		Each
Nickel Alloys, Copper, Brass, Bronze, Zinc	1	Liquid	Flux Remover	IPC J-STD-004	0000000	000000