High-Density Low-Melting-Point Solder
This bismuth-tin solder has similar performance properties to lead solder, but is also safe for use in food-processing equipment and copper water pipes. It has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components, as well as for step soldering with traditional solders. However, it’s less thermally conductive than other metals and more brittle than lead. Flux isn’t required, but for easier cleanup use it with no-clean soldering flux. This solder is lead-free, so it is safer to use than leaded solder and helps meet industry regulations. Do not use this solder on drinking water pipes.
Solder with 1% silver forms stronger bonds than solder without silver. It’s also more malleable and ductile. However, it has a higher melting point, so it takes longer to solder.
No-Flux Solder for Aluminum
Flux is not required for this solder to form strong joints. It is lead-free, so it is safer to use than leaded solder and helps meet industry regulations.
For technical drawings and 3-D models, click on a part number.
Material Composition | |||||||||
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Solder Composition | Zinc | Aluminum | Lead | Melting Temperature, °F | Dia. | Lg. | Wt., lbs. | Pkg. of 37 | |
Zn98Al2 | 98% | 2% | 0% | 760° | 0.125" | 18" | 2 | 000000 | 000000 |
Paste Solder
Use this paste in hard-to-reach areas—apply a thin coat of paste to the surfaces you want joined, apply heat, and wipe with a damp cloth. Paste is made of finely powdered solder combined with a flux paste, so it creates strong welds without needing separate flux. It is lead-free, which means it is safer to use than leaded solder and helps meet industry regulations.
Material Composition | |||||||||
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Solder Composition | Tin | Antimony | Lead | Melting Temperature, °F | Solder Type | Form | Wt., lbs. | Each | |
For Joining Brass, Copper, Nickel Alloys, Steel, Zinc | |||||||||
Sn95Sb5 | 95% | 5% | 0% | 470° | No Flux Required | Paste | 1 | 0000000 | 000000 |