About Structural Adhesives
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Low-Melting-Point Solder for Low-Temperature Applications
Even as temperatures approach absolute zero, this indium solder remains soft and malleable, allowing it to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. This solder has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications.
This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core; choose soldering flux to prepare workpieces for this solder.
Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
Lead-free solder is safer to use than leaded solder and helps meet industry regulations. Solder that is 100% indium has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin. Solder with 48% tin has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
Material Composition | ||||||||||
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Solder Composition | Indium | Lead | Silver | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Diameter | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | ||||||||||
In80Pb15Ag5 | 80% | 15% | 5% | 310° | 43 | 2,550 | 0.030" | 0.16 | 0000000 | 0000000 |
Material Composition | ||||||||||
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Solder Composition | Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Diameter | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | ||||||||||
In52Sn48 | 52% | 48% | 0% | 245° | 34 | 1,720 | 0.030" | 0.11 | 0000000 | 0000000 |
In100 | 100% | __ | 0% | 315° | 86 | 270 | 0.030" | 0.11 | 0000000 | 000000 |
Low-Melting-Point Solder Ribbon for Low-Temperature Applications
Made with indium this solder is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. Thanks to its ribbon shape, this solder is easier to use on large, flat areas than wire solder.
This solder has a lower melting point than most solders, making it good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so you can also use it in high-vacuum applications.
This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core, choose soldering flux to prepare workpieces for this solder.
Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
Material Composition | ||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Solder Composition | Indium | Lead | Silver | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Length | Width | Thickness | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | ||||||||||||
In80Pb15Ag5 | 80% | 15% | 5% | 310° | 43 | 2,550 | 12" | 1" | 0.002" | 0.1 | 0000000 | 0000000 |
Material Composition | ||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Solder Composition | Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Length | Width | Thickness | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | ||||||||||||
In52Sn48 | 52% | 48% | 0% | 245° | 34 | 1,720 | 12" | 1" | 0.002" | 0.1 | 0000000 | 0000000 |
In100 | 100% | __ | 0% | 315° | 86 | 270 | 12" | 1" | 0.002" | 0.1 | 0000000 | 000000 |
Conductive Surface Fillers for Electronics
A high silver content allows these surface fillers to conduct electricity and heat. Use them to fill gaps and rebuild missing material on electrical connections or to assemble new components. They come as two parts. The size listed is the combined total of the two parts.
Volume resistivity measures how well a material opposes the flow of electricity. The lower the rating, the more electricity it conducts.
Thermal conductivity measures a material’s ability to transfer heat. The higher the rating, the more heat it transfers.
Container | Temp. Range, °F | ||||||||||||
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Mfr. Model No. | Size, fl. oz. | Net Weight, oz. | Type | Begins to Harden | Reaches Full Strength | Thermal Conductivity, W/m-K | Volume Resistivity, ohms-cm | Mix Ratio | Min. | Max. | For Use On | Each | |
Loctite® Surface Fillers | |||||||||||||
3888 | __ | 0.09 | One-Time-Use Packet | 90 min. | 24 hrs. | 1.44 | 0.001 | 100:6 | -40° | 170° | Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Titanium, Polycarbonate Plastic | 0000000 | 000000 |
Surface Fillers | |||||||||||||
__ | __ | 0.09 | One-Time-Use Packet | 90 min. | 24 hrs. | 6.05 | 0.009 | 100:6 | -75° | 250° | Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Titanium, Ceramic, Glass | 0000000 | 00000 |
__ | __ | 0.35 | One-Time-Use Packet | 90 min. | 24 hrs. | 6.05 | 0.009 | 100:6 | -75° | 250° | Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Titanium, Ceramic, Glass | 0000000 | 000000 |
__ | 0.5 | __ | Jar | 4 hrs. | 5 days | 5.77 | 0.0004 | 1:1 | Not Rated | 300° | Aluminum, Brass, Copper, Steel, Stainless Steel | 0000000 | 000000 |
__ | 1 | __ | Jar | 4 hrs. | 5 days | 5.77 | 0.0004 | 1:1 | Not Rated | 300° | Aluminum, Brass, Copper, Steel, Stainless Steel | 0000000 | 000000 |
Conductive Surface Filler Pens for Electronics
Dispense ready-to-use conductive liquid to fill pits and small gaps on circuit board components. These pens are also used to sketch and repair conductive pathways.
Product labeling requirements restrict sales to the listed areas.
Carbon acrylic pens should be used where only a small amount of conductivity is needed, such as circuit boards in keyboards. Their high surface resistivity only allows a small current to pass.
Nickel acrylic pens are best for general purpose repairs, such as bridges and traces in printed circuit boards. They have a medium surface resistivity, so they're a good balance between carbon acrylic and silver epoxy pens.
Silver epoxy pens are the most versatile—use them for any type of repair as well as for repairs that require excellent conductivity, such as connecting through holes on circuit boards without adding jumpers, wiring, or solder. Since they have the lowest surface resistivity, they allow the most current to pass.
Tip | ||||||||||||||
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Container Size, fl. oz. | Dia. | Shape | Begins to Harden, min. | Reaches Full Strength | Surface Resistivity, ohms/sq. | Consistency | Max. Thick. | For Use Outdoors | Temp. Range, °F | Color | For Use On | Cannot Be Sold To | Each | |
Carbon Acrylic | ||||||||||||||
0.2 | 0.06" | Point | 2 | 24 hrs. | 100 | Thin Liquid | 0.003" | Yes | -40° to 245° | Black | Plastic | Canada | 0000000 | 000000 |
Nickel Acrylic | ||||||||||||||
0.2 | 0.06" | Point | 2 | 24 hrs. | 0.49 | Thin Liquid | 0.004" | Yes | -40° to 245° | Gray | Plastic | Canada | 0000000 | 00000 |
Silver Epoxy | ||||||||||||||
0.2 | 0.03" | Point | 3 | 60 min. | 0.050 | Thin Liquid | Not Rated | No | -65° to 300° | Silver | Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Titanium | Outside United States and Canada | 0000000 | 00000 |
Conductive Adhesives for Electronics
An alternative to solder, these flexible, silver-filled adhesives accommodate joint movement. Use them to bond electrical components and repair circuits.
Epoxy adhesives are two-part adhesives that need to be mixed together. The size listed is the combined total of the two parts.
Container | |||||||||||
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Size, fl. oz. | Net Weight, oz. | Begins to Harden | Reaches Full Strength | Thermal Conductivity, W/m-K | Surface Resistivity, ohms-cm | Mix Ratio | Consistency | Temp. Range, °F | For Joining | Each | |
One-Time-Use Packet | |||||||||||
__ | 0.09 | 3 hrs. | 24 hrs. | 1.55 | 0.05 | 1:1.15 | Paste | -75° to 230° | Ceramic, Glass, Metal | 0000000 | 000000 |
Can | |||||||||||
0.5 | __ | 4 hrs. | 5 days | 7.93 | 0.0004 | 1:1 | Paste | 80° to 265° | Metal | 0000000 | 000000 |
1 | __ | 4 hrs. | 5 days | 7.93 | 0.0004 | 1:1 | Paste | 80° to 265° | Metal | 0000000 | 000000 |