Rosin Flux-Core Solder for Electronics and Electrical Applications
Rosin flux is quick acting with strong cleaning action, but it leaves residue that requires flux remover. This solder is electrically conductive, so it’s good for electronics and electronic applications.
Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
Material Composition | |||||||
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Solder Composition | Tin | Lead | Melting Temperature, °F | Dia. | Wt. | Each | |
For Joining Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | |||||||
Sn50Pb50 | 50% | 50% | 420° | 0.032" | 1 lbs. | 00000000 | 000000 |
Material Composition | ||||||||
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Solder Composition | Tin | Copper | Lead | Melting Temperature, °F | Dia. | Wt. | Each | |
For Joining Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | ||||||||
Sn99.3Cu0.7 | 99.3% | 0.7% | 0% | 440° | 0.032" | 1 lbs. | 00000000 | 000000 |
Fast-Flowing Rosin Flux-Core Solder for Electronics and Electrical Applications
The five flux cores allow fast soldering that uses less solder and transmits less heat to the joint. Rosin flux is quick acting with strong cleaning action but leaves residue that requires flux remover. Since this solder is electrically conductive, it’s good for electronics and electrical applications.
Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
For technical drawings and 3-D models, click on a part number.
Fast-Flowing No-Clean Flux-Core Solder for Electronics and Electrical Applications
The five flux cores in this solder allow fast soldering that uses solder efficiently and reduces the heat to your joint. The flux it’s filled with leaves minimal residue so there’s no cleanup. This solder is electrically conductive, making it good for electronics and electrical applications.
Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
For technical drawings and 3-D models, click on a part number.
Material Composition | ||||||||||
---|---|---|---|---|---|---|---|---|---|---|
Solder Composition | Tin | Silver | Antimony | Copper | Lead | Melting Temperature, °F | Dia. | Wt., lbs. | Each | |
Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | ||||||||||
Sn96.5Ag3Cu0.5 | 96.5% | 3% | 0% | 0.5% | 0% | 425° | 0.032" | 1 | 0000000 | 0000000 |
Sn96Ag4 | 96% | 4% | 0% | 0% | 0% | 430° | 0.032" | 1 | 0000000 | 000000 |
Sn97Ag3 | 97% | 3% | 0% | 0% | 0% | 430° | 0.032" | 1 | 0000000 | 000000 |
Fast-Flowing Easy-Clean Flux-Core Solder
for Electronics and Electrical Applications
Electrically conductive and with five flux cores, this solder speeds up the process of soldering electronics, so you use less solder and transmit less heat to the joint. Easily wash away the flux residue with just water.
For technical drawings and 3-D models, click on a part number.
Solder for Electronics and Electrical Applications
Electrically conductive, this solder is best for electronics and electronics applications. It does not have a flux core, so you can choose the flux that works best for your application.
Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
Rosin Flux-Core High-Melting-Point Solder
for Electronics and Electrical Applications
Rosin flux is quick acting with strong cleaning action, but leaves residue that requires flux remover. The high melting point of this solder prevents remelting when soldering successive joints with another solder. It is electrically conductive.
Material Composition | ||||||||
---|---|---|---|---|---|---|---|---|
Solder Composition | Tin | Lead | Silver | Dia. | Melting Temperature, °F | Wt., lbs. | Each | |
For Joining Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | ||||||||
Sn5Pb93Ag2 | 5% | 93% | 2% | 0.032" | 535° | 1 | 0000000 | 000000 |
Solder
Use this solder for general purpose applications. It does not have a flux core, so you can choose the flux that works best for your application.
Solder for Stainless Steel
Without a flux core, this solder allows you to choose the flux that works best for your application.
For technical drawings and 3-D models, click on a part number.
Material Composition | ||||||||
---|---|---|---|---|---|---|---|---|
Solder Composition | Tin | Lead | Silver | Melting Temperature, °F | Dia. | Wt., lbs. | Each | |
Leaded | ||||||||
Sn45Pb54Ag1 | 45% | 54% | 1% | 410° | 0.032" | 1 | 0000000 | 000000 |