Heat-Transfer Foil
Made of indium, this foil is more thermally conductive than thermal interface materials (TIMs) made of plastic. By efficiently pulling heat away from components that produce heat, such as CPUs, this foil lets you use smaller forced cooling systems to extend battery life. It’s also softer and more ductile than paste and putty, covering surfaces better to minimize airflow gaps and increase heat flow. Unlike paste and grease, this foil won’t leach out from between surfaces over time, nor will it dry out and lose effectiveness. It’s clean, easy to install and reposition, and requires no surface preparation. Foil is corrosion resistant and doesn’t need special storage.
Foil with 48% tin has greater tensile and shear strength than foil without tin, but is less thermally conductive.
Each | Package | ||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|
Thickness | Tensile Strength, psi | Shear Strength, lbs./sq. in. | Maximum Temperature, °F | Thermal Conductivity @ Temperature | Electrical Resistivity | For Use Outdoors | Each | Pkg. Qty. | Pkg. | ||
2" × 2" | |||||||||||
Indium | |||||||||||
0.004" | 270 | 890 | 255° | 86 W/m-K @ 185° F | 7.2×106 ohms-cm | No | 0000000 | 000000 | 20 | 0000000 | 0000000 |
0.01" | 270 | 890 | 255° | 86 W/m-K @ 185° F | 7.2×106 ohms-cm | No | 0000000 | 00000 | 20 | 0000000 | 000000 |
Indium Alloy (48% Tin) | |||||||||||
0.004" | 1,730 | 1,620 | 190° | 34 W/m-K @ 185° F | 1.5×105 ohms-cm | No | 0000000 | 00000 | 20 | 0000000 | 000000 |
0.01" | 1,730 | 1,620 | 190° | 34 W/m-K @ 185° F | 1.5×105 ohms-cm | No | 0000000 | 00000 | 20 | 0000000 | 000000 |