Heat Sink Bonding Compounds
Bond heat sinks to surfaces, eliminating air gaps for maximum heat transfer. These compounds are commonly used with transistors, diodes, rectifiers, and transformers. Product regulations restrict sales to the listed jurisdictions/areas.
Zinc-oxide compounds create a more secure bond than silicone compounds.
Container | |||||||
|---|---|---|---|---|---|---|---|
| Thermal Conductivity | Temp. Range, °F | Type | Size, fl. oz. | Specifications Met | Cannot Be Sold To | Each | |
Zinc Oxide | |||||||
| 0.92 W/m-K @ 97° F | -40° to 320° | Tube | 2 | MIL-C-47113 | __ | 0000000 | 000000 |
| 0.92 W/m-K @ 97° F | -40° to 320° | Syringe | 1 | MIL-C-47113 | __ | 00000000 | 00000 |
| 0.92 W/m-K @ 97° F | -40° to 390° | Tube | 4 | ASTM D5470 | Outside United States and Canada | 00000000 | 00000 |
| 0.92 W/m-K @ 97° F | -40° to 390° | Jar | 16 | ASTM D5470 | Outside United States and Canada | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Tube | 2 | __ | __ | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Tube | 4 | __ | __ | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Jar | 16 | __ | __ | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Syringe | 1 | __ | __ | 00000000 | 00000 |