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Heat Sink Bonding Compounds
Bond heat sinks to surfaces, eliminating air gaps for maximum heat transfer. These compounds are commonly used with transistors, diodes, rectifiers, and transformers.
Container | ||||||||
|---|---|---|---|---|---|---|---|---|
| Thermal Conductivity | Temp. Range, °F | Type | Size, fl. oz. | Net Weight, lbs. | Manufacturer | Manufacturer Model Number | Each | |
Silicone | ||||||||
| 0.68 W/m-K @ 97° F | -40° to 390° | Tube | 5 | __ | Dow Corning | 340 | 00000000 | 000000 |
| 0.75 W/m-K @ 97° F | -40° to 400° | Tube | 8 | __ | __ | __ | 00000000 | 00000 |
| 0.75 W/m-K @ 97° F | -40° to 400° | Pail | __ | 80 | __ | __ | 000000000 | 00000000 |