No-Clean Soldering Flux for Electronics
This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Paste flux is easier to apply than liquid flux for precise applications.
Container | Tip | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| For Joining | Size | Net Weight | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Features | Cannot Be Sold To | Each | |
| Copper, Brass, Bronze | 0.3 fl. oz. | __ | Pen | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | __ | Outside United States and Canada | 0000000 | 00000 |
| Nickel Alloys, Copper, Brass, Bronze | 0.3 fl. oz. | __ | Syringe | __ | __ | Paste | No Clean | IPC J-STD-004 | Luer Lock Connection | __ | 0000000 | 00000 |
| Nickel Alloys, Copper, Brass, Bronze | __ | 3 1/2 oz. | Jar | __ | __ | Paste | No Clean | IPC J-STD-004 | __ | __ | 0000000 | 00000 |
| Nickel Alloys, Copper, Brass, Bronze | __ | 1 lbs. | Jar | __ | __ | Paste | No Clean | IPC J-STD-004 | __ | __ | 0000000 | 000000 |
Lead-Free No-Clean Soldering Flux for Electronics
This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Tip | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| For Joining | Container Size, fl. oz. | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
| Copper, Brass, Bronze | 0.3 | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | Outside United States and Canada | 0000000 | 000000 |
No-Clean Soldering Flux for Low-Melting-Point Solders
Prepare workpieces for low-temperature lead-free soldering. This flux leaves minimal residue, so there’s no cleanup required. It doesn’t need to be used quickly; it can sit for hours without degrading.
No-Clean Brazing Flux for Joining Aluminum to Copper
Clean and prepare surfaces before joining aluminum to copper. With minimal residue, this flux does not require cleanup.