Empty Needle-Point Pen Dispenser for Soldering Flux
Fill this dispenser with the flux of your choice to prepare electrical assemblies and printed circuit boards for soldering.
Tip | ||||
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Container Size, fl. oz. | Shape | Diameter | Each | |
1/5 | Needle Point | 0.013" | 0000000 | 00000 |
No-Clean Soldering Flux for Electronics
This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Paste flux is easier to apply than liquid flux for precise applications.
Container | Tip | ||||||||||
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For Joining | Size | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Features | Cannot Be Sold To | Each | |
Copper, Brass, Bronze | 0.3 fl. oz. | Pen | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | __ | Outside United States and Canada | 0000000 | 00000 |
Nickel Alloys, Copper, Brass, Bronze | 0.3 fl. oz. | Syringe | __ | __ | Paste | No Clean | IPC J-STD-004 | Luer Lock Connection | __ | 0000000 | 00000 |
Lead-Free No-Clean Soldering Flux for Electronics
This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Tip | |||||||||
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For Joining | Container Size, fl. oz. | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
Copper, Brass, Bronze | 0.3 | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | Outside United States and Canada | 0000000 | 000000 |
Mildly-Activated Rosin Soldering Flux for Electronics
This flux has strong cleaning action and leaves residue that will not compromise the reliability of the joint. The residue requires flux remover. Use this flux to clean and prepare electrical assemblies and printed circuit boards for soldering.
Paste flux is easy to apply in precise applications.
Nonactivated Rosin Soldering Flux for Electronics
This flux has less cleaning action, but leaves the least amount of residue. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Container | Tip | |||||||||
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For Joining | Size | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
Copper, Brass, Bronze | 0.3 fl. oz. | Pen | Chisel | 0.2" | Liquid | Flux Remover | IPC J-STD-004 | Outside United States and Canada | 0000000 | 00000 |
Easy-Clean Soldering Flux for Electronics
The flux residue easily washes away with water. The flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Paste flux is easy to apply for precision applications.
Container | Tip | |||||||||
---|---|---|---|---|---|---|---|---|---|---|
For Joining | Size | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
Copper, Brass, Bronze | 0.3 fl. oz. | Pen | Chisel | 0.2" | Liquid | Water | IPC J-STD-004 | Outside United States and Canada | 0000000 | 00000 |
Nickel Alloys, Copper, Brass | 0.3 fl. oz. | Pen | Chisel | 0.157" | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
Nickel Alloys, Copper, Brass | 0.3 fl. oz. | Syringe | Needle Point | 0.031" | Paste | Water | IPC J-STD-004 | __ | 000000 | 00000 |
No-Clean Soldering Flux for Low-Melting-Point Solders
Prepare workpieces for low-temperature lead-free soldering. This flux leaves minimal residue, so there’s no cleanup required. It doesn’t need to be used quickly; it can sit for hours without degrading.
Soldering Flux for Stainless Steel
Often used on metal that is difficult to solder, this flux works with stainless steel, Monel, and Inconel. Easily wash away residue with water.
Paste flux is easier to apply than liquid flux, so it is a good choice for precise applications.
Container | Tip | |||||||
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Size, fl. oz. | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Each | |
0.3 | Syringe | Needle Point | 0.055" | Paste | Water | Fed. Spec. A-A-51145 Type I Form A | 0000000 | 000000 |