Made with indium this solder is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. Thanks to its ribbon shape, this solder is easier to use on large, flat areas than wire solder.

This bismuth-tin solder has similar performance properties to lead solder, but is also safe for use in food-processing equipment and copper water pipes.

Without a flux core, this solder allows you to choose the flux that works best for your application.

Often used to solder aluminum to difficult-to-solder metal such as stainless steel and nickel, this flux works in applications up to 800° F.

Flux is already built into these alloys, so there’s no need to add it when joining aluminum to copper.

No need to add flux when brazing aluminum parts such as radiators, power tools, and castings—these alloys don’t require it.

Clean and prepare surfaces for brazing jobs that require you to join aluminum.

The handle has a magnet at the end to pick up small steel objects. Use these picks to hold and position wire, springs, and other small parts.

Sets include a handle and an assortment of tips for holding and positioning wire, springs, and other small parts.

Install and position tiny springs and wires. Unlike conventional picks that have pointed tips, these are rounded to prevent damage to sensitive components.

Similar to dental instruments, these needle-sharp picks are suitable for work around delicate circuits and components.

More conformable than copper foil electrical tape, this tape bonds to textured electronic housings, round cables, and other curved and irregular surfaces. Since it doesn’t leave gaps, it’s a great shield against electromagnetic interference (EMI).

Tested to meet ASTM E595, a standard used by NASA, this tape gives off almost no volatile emissions that could damage sensitive electronics, even in a vacuum. It’s more conformable than copper tape, so you can cover textured housings and round cables without leaving gaps for electromagnetic interference (EMI) to get in.

Dispense ready-to-use conductive liquid to fill pits and small gaps on circuit board components.